Rigid-Flex PCB, manufactured by integrated lamination of FR4 rigid substrate and PI flexible substrate. It combines the component mounting capability of rigid boards and the bendable property of flexible boards. Supporting 3D routing, it reduces connectors in the complete device and lowers contact failures. Multi-layer circuits, blind and buried vias, and impedance control are available. Surface finishes such as ENIG, ENEPIG are optional. It features high and low temperature resistance and stable anti-vibration performance. Widely applied in high-precision devices including foldable terminals, camera modules, medical electronics, automotive electronics, optical modules and smart wearables.