This product includes high thermal conductivity aluminum base PCBs and copper base PCBs. They feature excellent heat dissipation and ultra-low thermal resistance, stable breakdown voltage of dielectric layer, high temperature resistance and low risk of delamination and blistering. Customized board thickness, copper thickness and precise circuit processes are available with high line spacing accuracy for various high-power circuit designs. A full range of surface finishes are offered with strong adhesion, stable peel strength and reliable thermal cycle performance. The substrates effectively reduce device operating temperature and improve product stability and service life. Widely applied in LED lighting, switching power supplies, driver units, high-power modules and new energy thermal management, customized production is available.