航天航空领域PCB | 零件,组件及电器用品
中国内地
展位编号: 5C-B14 | 电子配件及移动电子产品 | 粤贸全球
产品规格
质量标准

遵循 IPC Class3/3A,AS9100 质量管控;全流程物料追溯,100% 飞针、AOI、X 光检测;可完成热循环、振动、老化等可靠性验证

应用

机载航电、卫星载荷、无人机飞控、雷达、导航、电源管理系统

基材选型

聚酰亚胺、氰酸酯、Rogers/Arlon 高频材料;空间级板材满足低出气要求,TML<1.0%、CVCM<0.1%,真空环境稳定,抗宇宙辐射

工艺能力

高阶多层、HDI 微盲孔、背钻、盘中孔;线宽线距高精度,可控阻抗,差分阻抗公差 ±5%;支持厚铜大功率板、刚挠一体化板,减重且适配三维安装

信号性能

高频板材低介电常数、低损耗,保障雷达、卫星通信毫米波信号完整性;抑制 CAF 离子迁移,长期绝缘稳定

环境耐受

可在 - 55℃~+125℃区间稳定工作,耐受多次热循环、高冲击与强振动,适配发射载荷;空间型号可扩展至更宽温区

产品简介
This series of aerospace PCBs are mission-critical electronic substrates adopting special materials such as polyimide and Rogers. Featuring excellent high and low temperature resistance, vibration and shock resistance, radiation resistance and low outgassing performance, they are applicable for harsh environments including vacuum and drastic temperature cycling. Supporting precision processes such as high-layer-count multilayers, HDI micro-vias, backdrilling and controlled impedance, the products cover high-frequency microwave boards and rigid-flex boards. Manufactured in accordance with IPC Class3 standards with full material and process traceability, complete testing and reliability verification are available. The PCBs are widely applied in avionics systems, satellite payloads, UAVs, radar, navigation and communication equipment.


生产所需时间

7 日