參展商

Multi Layer PCB, Printed Circuit Board, 0.2至2.4mm board thickness 多層板、線路板、0.2至2.4mm板厚

Selective Gold Finishing, PCB, Printed Circuit Board, Thick Gold 選擇位置金板、線路板、厚金板

雙面板、電子線路板、半孔板工序

雙面板、電子線路板、-沉錫板、高頻線路板

高頻板、厚金板、藍色阻焊油

雙面或多層電子線路板、1.60mm板厚、沉金工序、藍色阻焊油、汽車產品線路板、ISO 16949認証

Single Layer to 12 Layer PCB with Customer Design, Immersion Gold, Flash Gold, Hot Air Solder Leveling Finishing with Routing Process

<ul><li>Rigid PCB</li><li>8-Layer</li><li>FR-4</li><li>Tg170</li><li>1.60mm board thickness</li><li>Immersion Gold</li><li>Green Soldermask Color</li><li>White Silkscreen Color</li></ul>

<ul><li>PCB for automobile</li><li>1.60mm board thickness</li><li>Double layer or multi layer board</li><li>Immersion Gold</li><li>Blue Solder mask</li></ul>

This rigid PCB is meticulously made of the FR-4 material, sporting a strong construction with exceptional wear resistance. The two-layer conductive structure guarantees high-speed and stable connecting performance for a long service life with the surface covered by the solder mask and immersion gold finishing. • Material: FR-4.• 2-layer conductive structure.• Board Thickness: 1.5mm• High Tg: Tg150 °C or Tg170 °C.• Finishing: immersion gold.• Blue solder mask..

<ul><li>Rigid PCB</li><li>FR-4 Material</li><li>Double Layer</li><li>Green Soldermask Color</li></ul>

<ul>
 <li>環氧玻璃纖維板---沉金工序---板邊電鍍。</li>
</ul>

<ul>
 <li>環氧玻璃纖維板---沉金工序---阻抗控制。</li>
</ul>

<ul>
 <li>無鉛噴錫。</li>
 <li>開關及電源供應器產品。</li>
</ul>

<ul>
 <li>環氧玻璃纖維板---電金工序。</li>
</ul>

<ul>
 <li>無鉛噴錫---開關電源供應器產品。</li>
</ul>

<ul>
 <li>環氧玻璃纖維板---高溫物料170度。</li>
</ul>

<ul>
 <li>Single Layer, Double Layer, Mulit Layer as 4 to 12 Layer, Aluminum Board also available.</li>
 <li>Entek Coating, Immersion Gold, Immersion Silver, Flash Gold Plating, Hot Air Solder Leveling.</li>
</ul>

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