Waste Audit Module (Fill Level and Image)
Waste Audit Module (Fill Level and Image)
Hong Kong
Booth: 3-D02 | HKSTP Pavilion
Product Specification
Application

Bin Monitoring

Weight

105g

Size

96mm x 56mm x 40mm

Product Description
  • Measures Fill Level
  • Captures Image
  • Wireless Connectivity
  • Expandability
  • Battery-powered
Production Lead Time

14 days