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(1)Semiconductor chip test probe Top Plunger&amp; Bottom PlungerPd Alloy： Top plunger,Bottom plungerBeCu： Top plunger,Bottom plungerSK4： Top plunger,Bottom plunger(2)Manufacturing TechnologyCompound cutting with high precision CNC automatic lathe.Heat treatment.Manufacture of bars and coils of palladium alloys, etc.Surface finishing.(3)Special Processing TechnologyUltra-micro machining capability:part OD＞0.02mm.Micro compound cutting,front and rear end processing.Micro hole machining,hole ID＞0.10mm.Mirror surface processing on probe head.Precision metal alloy drawing,straightening and cutting.

Common Applications- Spring probes and pogo pins- ATE socket contacts- RF and signal terminals- High-reliability connectors for automotive, telecom, and medical devicesPd Alloy Rods from Goldlink - Key Advantages- Diameter Range: 0.10 mm - 1.00 mmHigh-precision rod drawing for micro-electronic components- High-Performance Pd Alloy GradesOptimized for conductivity, durability, and corrosion resistanceNo surface plating required - suitable for direct-use in probe and socket applications- Multiple Performance OptionsAvailable in different mechanical strengths and hardness levels to meet diverse technical requirements- Certified Quality ControlProduced under ISO 9001 quality management systemMaterial certification and test data available (composition, conductivity, mechanical properties)- Efficient Global LogisticsBased in Hong Kong, ensuring fast and reliable shipping to Asia, Europe, and North America

(1)Phosphor Bronze BarrelID≥0.16mmWT≥0.025mmAvailable in plated and unplated PB barrels, plating: Ni + Gold.Can be made with various flanges on the outer surface.(2)Pd Alloy BarrelMost suitable for thin-walled micro probes (lnner diameter 0.1mm to 0.25mm,wall thickness 0.012mm to 0.03mm).Good conductivity, wear resistance, and oxidation resistance, no need for gold plating.Good hardness HV250 to HV300.High strength, tensile strength 870-900MPa.Can make various flanges on the outer surface.Lower cost. The palladium content of GPAC800 is as low as 20%.Application on non-magnetic probes.(3)Electroformed Nickel BarrelOD：φ:0.06~1.0mmID：φ:0.05~0.9mmID Tolerance :±0.003mm,Length tolerance : ±0.02mm,End surfaces are burr-free.Outer diameter, inner diameter and length can be customized according to customers' needs.Both the inner and outer surfaces of the barrel can be gold plated as required.Both straight barrels and barrels with crimp can be supplied.The thinner tube wall allows the inner diameter to be enlarged (minimum wall thickness of 0.005mm), allowing the installation of springs with higher spring force.

(1)Semiconductor chip test probe Top Plunger&amp; Bottom PlungerPd Alloy： Top plunger,Bottom plungerBeCu： Top plunger,Bottom plungerSK4： Top plunger,Bottom plunger(2)Manufacturing TechnologyCompound cutting with high precision CNC automatic lathe.Heat treatment.Manufacture of bars and coils of palladium alloys, etc.Surface finishing.(3)Special Processing TechnologyUltra-micro machining capability:part OD＞0.02mm.Micro compound cutting,front and rear end processing.Micro hole machining,hole ID＞0.10mm.Mirror surface processing on probe head.Precision metal alloy drawing,straightening and cutting.

Common Applications- Spring probes and pogo pins- ATE socket contacts- RF and signal terminals- High-reliability connectors for automotive, telecom, and medical devicesPd Alloy Rods from Goldlink - Key Advantages- Diameter Range: 0.10 mm - 1.00 mmHigh-precision rod drawing for micro-electronic components- High-Performance Pd Alloy GradesOptimized for conductivity, durability, and corrosion resistanceNo surface plating required - suitable for direct-use in probe and socket applications- Multiple Performance OptionsAvailable in different mechanical strengths and hardness levels to meet diverse technical requirements- Certified Quality ControlProduced under ISO 9001 quality management systemMaterial certification and test data available (composition, conductivity, mechanical properties)- Efficient Global LogisticsBased in Hong Kong, ensuring fast and reliable shipping to Asia, Europe, and North America

(1)Semiconductor chip test probe Top Plunger&amp; Bottom PlungerPd Alloy： Top plunger,Bottom plungerBeCu： Top plunger,Bottom plungerSK4： Top plunger,Bottom plunger(2)Manufacturing TechnologyCompound cutting with high precision CNC automatic lathe.Heat treatment.Manufacture of bars and coils of palladium alloys, etc.Surface finishing.(3)Special Processing TechnologyUltra-micro machining capability:part OD＞0.02mm.Micro compound cutting,front and rear end processing.Micro hole machining,hole ID＞0.10mm.Mirror surface processing on probe head.Precision metal alloy drawing,straightening and cutting.

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