Thermal interface material (TIM) improves the heat dissipation efficiency between electronics and heat sink. A paradigm shift to the miniaturization and increase of power density of the electronic devices has driven the need for TIM with great application flexibility, soft and tacky, together with high thermal conductivity. NAMI has developed a high-performance, one-part, dispensable thermal gel with 6.5 W/m.K thermal conductivity and 25g/min dispensing rate. It is ideal for automated dispensing machines, on-the-spot repair.

Major Benefits

• High thermal conductivity
• Excellent dispensing properties, can be integrated with automated manufacturing
• Low closure force and covers various geometry
• No secondary curing required

Application Areas

• Microprocessors
• 5G telecom base stations
• Power devices