Semiconductor chip test probe head (Pd Alloy,Straight Crown) | Parts, Components & Raw Materials
    Semiconductor chip test probe head (Pd Alloy,Straight Crown)
    GOLDLINK TECH (HK) CO., LIMITED
    Hong Kong
    Booth: 5B-E27 | Test and Inspection Equipment |
    Product Specification
    Product Description

    (1)Semiconductor chip test probe Top Plunger& Bottom Plunger

    Pd Alloy： Top plunger,Bottom plunger

    BeCu： Top plunger,Bottom plunger

    SK4： Top plunger,Bottom plunger

    (2)Manufacturing Technology

    Compound cutting with high precision CNC automatic lathe.

    Heat treatment.

    Manufacture of bars and coils of palladium alloys, etc.

    Surface finishing.

    (3)Special Processing Technology

    Ultra-micro machining capability:part OD＞0.02mm.

    Micro compound cutting,front and rear end processing.

    Micro hole machining,hole ID＞0.10mm.

    Mirror surface processing on probe head.

    Precision metal alloy drawing,straightening and cutting.

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